针对新项目的创新及协作式同步项目管理
汽车及交通运输行业
Integration of mechanical, software and electronic systems technologies for vehicle systems
了解行业应用能源与公用事业
Supply chain collaboration in design, construction, maintenance and retirement of mission-critical assets
了解行业应用Heavy Equipment
Construction, mining, and agricultural heavy equipment manufacturers striving for superior performance
Explore Industry工业机械与重型装备行业
Integration of manufacturing process planning with design and engineering for today’s machine complexity
了解行业应用Insurance & Financial
Visibility, compliance and accountability for insurance and financial industries
Explore IndustryMedia & Telecommunications
Siemens PLM Software, a leader in media and telecommunications software, delivers digital solutions for cutting-edge technology supporting complex products in a rapidly changing market.
Explore IndustrySmall & Medium Business
Remove barriers and grow while maintaining your bottom line. We’re democratizing the most robust digital twins for your small and medium businesses.
Explore IndustryHeatsink thermal design insights for electronics cooling demonstrated with thermal CFD simulation
Heatsink thermal design insights for electronics cooling demonstrated with thermal CFD simulation
How to design an efficient heatsink and leverage thermal simulation
Heatsinks are used extensively for electronics thermal management, whether standalone or in combination with other electronic cooling solutions. This ensures critical electronics components operate within junction temperature limits for reliability and to maximize performance.
Attend this webinar to learn about designing an efficient heatsink for heat dissipation. Topics start from heat transfer and fluid flow fundamentals through to useful tips and performance factors to consider in system integration. Concepts will be illustrated with thermal CFD simulation examples. Learn more about the value of evaluating tradeoff designs efficiently with parametric studies and design space exploration so you can achieve your thermal management design goals for thermal performance and minimized cost.
Thermal design topics:
Whether you are designing a heatsink utilizing natural convection cooling, forced convection fan-cooled heatsinks, sealed enclosure casings as heatsinks, or where heatsinks are incorporated with other electronics cooling solutions, this presentation is relevant to you.
Optimizing a heatsink to dissipate heat efficiently from a device to its ambient surroundings focuses typically on low thermal resistance and maximizing surface area exposed to airflow. This webinar will go into the full range of influences on the performance of a heatsink, so you are equipped to develop or select an efficient heatsink for your design whilst considering cost constraints. Physical factors including:
To fully understand performance, heat dissipation to the surroundings via heatsinking must be considered in the system environment and operational conditions. For example, think of cooling a single high power component in a passive manner with natural convection in an enclosure; or multiple heatsinks cooling several components on a detailed PCB with complex airflow in a fan-cooled server; or where a heatsink is integrated with a heat pipe to dissipate heat away from the critical component in small form factor consumer electronics products. Several reasons why you need to consider heatsink performance in a system will be discussed at this webinar using examples.
Technical presenters, each with between 20-35+ years in electronics thermal management experience in design, simulation and consulting, draw on their knowledge and background of extensive published conference papers and educational material to bring you this presentation.
Robin Bornoff, Senior Key Technical Expert
John Parry, Strategic Business Development Manager
John Wilson, Electronics Thermal Management Business Development Manager (Americas)
您好,鲍勃(将会在访问实际网站时替换为真实名字)
我们想要了解更多有关您的信息。
页面提交出错。请重新尝试。
首次订阅 Siemens Digital Industries Software 电子邮件?稍后您将收到一封电子邮件,请务必点击确认,以完成订阅。
您好,鲍勃(将会在访问实际网站时替换为真实名字)
本场网络研讨会将对您开放 90 天。请单击下方开始观看。
How to design an efficient heatsink and leverage thermal simulation
Heatsinks are used extensively for electronics thermal management, whether standalone or in combination with other electronic cooling solutions. This ensures critical electronics components operate within junction temperature limits for reliability and to maximize performance.
Attend this webinar to learn about designing an efficient heatsink for heat dissipation. Topics start from heat transfer and fluid flow fundamentals through to useful tips and performance factors to consider in system integration. Concepts will be illustrated with thermal CFD simulation examples. Learn more about the value of evaluating tradeoff designs efficiently with parametric studies and design space exploration so you can achieve your thermal management design goals for thermal performance and minimized cost.
Thermal design topics:
Whether you are designing a heatsink utilizing natural convection cooling, forced convection fan-cooled heatsinks, sealed enclosure casings as heatsinks, or where heatsinks are incorporated with other electronics cooling solutions, this presentation is relevant to you.
Optimizing a heatsink to dissipate heat efficiently from a device to its ambient surroundings focuses typically on low thermal resistance and maximizing surface area exposed to airflow. This webinar will go into the full range of influences on the performance of a heatsink, so you are equipped to develop or select an efficient heatsink for your design whilst considering cost constraints. Physical factors including:
To fully understand performance, heat dissipation to the surroundings via heatsinking must be considered in the system environment and operational conditions. For example, think of cooling a single high power component in a passive manner with natural convection in an enclosure; or multiple heatsinks cooling several components on a detailed PCB with complex airflow in a fan-cooled server; or where a heatsink is integrated with a heat pipe to dissipate heat away from the critical component in small form factor consumer electronics products. Several reasons why you need to consider heatsink performance in a system will be discussed at this webinar using examples.
Technical presenters, each with between 20-35+ years in electronics thermal management experience in design, simulation and consulting, draw on their knowledge and background of extensive published conference papers and educational material to bring you this presentation.
Robin Bornoff, Senior Key Technical Expert
John Parry, Strategic Business Development Manager
John Wilson, Electronics Thermal Management Business Development Manager (Americas)