Перейти к содержанию

Optimizing Electronics Cooling with 3D Printing

Запись вебинара | 35 минут

Increase your air flow efficiency with simulation, design and 3D printing.

3D printing has the potential to improve the efficiency of electronics cooling, leading to more robust equipment designs and longer lifespans.

HP and Siemens partnered on a project to make the cooling ducts in HP printers more efficient. With a combination of simulation, design and 3D printing, the team achieved air flow efficiency improvements of 23%. This webinar will discuss the process and tools used to achieve these improvements.

As electronics become more complicated and space in electronic devices continues to be at a premium, being able to create cooling that is unconstrained by the geometry required for conventional manufacturing becomes a game changer. This is the promise of 3D printing, or additive manufacturing.

Вы узнаете:

  • Gain insight into the robust software and hardware necessary to extract the full potential of 3D printing.
  • Understand why cooling of electronics is often not as efficient as it could be.
  • Learn how simulation, design and 3D printing are the basis for unlocking the potential of efficient electronics cooling.

Online, September 1, 2020

Mendix World 2020: Version 2.0

Mendix World 2020: Version 2.0

Did you know - Mendix, the leading low-code application platform, is part of Xcelerator and, with it, you can integrate your applications with any data source, any system of record? Be a part of the largest annual celebration of Makers, innovation, and leading low-code technology. Register today to get expert access, insight from other Makers, and hands-on low-code experience.