Simulating and Testing the Latest Technology for EV Power Electronics
Evaluating reliability with thermal characterization, simulation, and active power cycling.
With increasing vehicle electrification, adoption of new technologies and a constant drive for higher efficiency there are also the more strict quality and reliability requirements set by vehicle OEMs and Tier-1 suppliers for semiconductor component suppliers. During design stages of power electronics modules, thermal performance and reliability data is important for development and verification. For production, vehicle OEMs often request vendors provide quality test data for batches of components or each component.
This web seminar explains how test hardware accurately measures power electronics component thermal metrics, improves thermal simulation accuracy during power module development, and how to define and perform power cycling test studies to assess thermal reliability and predict lifetime. The presentation will encompass thermal testing of silicon based IGBTs and silicon carbide (SiC) MOSFET power devices, mission profile based testing combined with failure diagnosis, and a review of applying thermal transient testing to quality assessment to reduce risks of warranty costs.
You will learn:
- How to apply the JEDEC JESD 51-1 electrical test method for thermal characterization
- How structure functions support thermal design, simulation, failure diagnosis and defect identification
- Reliability and lifetime prediction using power cycling testing
Speaker:
Andras Vass-Varnai, Global Business Development Manager, Simcenter Thermal Test Solutions (formerly MicReD hardware)