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Aerospace & Defense
Innovation and collaborative, synchronized program management for new programs
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Integration of mechanical, software and electronic systems technologies for vehicle systems
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Innowacyjność produktów poprzez efektywne zarządzanie zintegrowanymi recepturami, opakowaniami i procesami produkcyjnymi
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New product development leverages data to improve quality and profitability and reduce time-to-market and costs
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Supply chain collaboration in design, construction, maintenance and retirement of mission-critical assets
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Construction, mining, and agricultural heavy equipment manufacturers striving for superior performance
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Integration of manufacturing process planning with design and engineering for today’s machine complexity
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Shipbuilding innovation to sustainably reduce the cost of developing future fleets
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Siemens PLM Software, a leader in media and telecommunications software, delivers digital solutions for cutting-edge technology supporting complex products in a rapidly changing market.
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Explore IndustryThermal analysis and thermomechanical simulation of electronics
Thermal analysis and thermomechanical simulation of electronics
Efficiently using electronics cooling CFD simulation and FEA analysis
The reliability of electronic devices has generally focused on temperature as a key measurable indicator. Further inspection indicates that it is a combination of thermo-mechanical effects, such as cracking of solder joints, that causes electronics reliability issues. To fully assess thermo-mechanical stresses requires a robust FEA thermo-mechanical analysis that draws on accurate 3D temperature data for thermal loads and a correct representation of mechanical behavior. This presentation focuses on the workflow to generate accurate thermo-mechanical stress results based on a transient 3D temperature field data in CFD software and seamlessly mapped to an FEA model
Please attend this webinar to learn about streamlining use of FEA analysis for thermal and thermomechanical stress analysis. This webinar focuses on workflow to generate 3D accurate transient 3D temperature field data in CFD software and seamlessly mapping that to an FEA mesh for thermomechanical stress simulation
Jean-Luc Emery
Business Development Manager Simcenter 3D, Siemens Digital Industries Software
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Witaj Bob (zostanie zastąpione prawdziwym imieniem przy wejściu na stronę)
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Efficiently using electronics cooling CFD simulation and FEA analysis
The reliability of electronic devices has generally focused on temperature as a key measurable indicator. Further inspection indicates that it is a combination of thermo-mechanical effects, such as cracking of solder joints, that causes electronics reliability issues. To fully assess thermo-mechanical stresses requires a robust FEA thermo-mechanical analysis that draws on accurate 3D temperature data for thermal loads and a correct representation of mechanical behavior. This presentation focuses on the workflow to generate accurate thermo-mechanical stress results based on a transient 3D temperature field data in CFD software and seamlessly mapped to an FEA model
Please attend this webinar to learn about streamlining use of FEA analysis for thermal and thermomechanical stress analysis. This webinar focuses on workflow to generate 3D accurate transient 3D temperature field data in CFD software and seamlessly mapping that to an FEA mesh for thermomechanical stress simulation
Jean-Luc Emery
Business Development Manager Simcenter 3D, Siemens Digital Industries Software