Innovation and collaborative, synchronized program management for new programs
Aerospace & Defense
Innovation and collaborative, synchronized program management for new programs
Explore IndustryAutomotive & Transportation
Integration of mechanical, software and electronic systems technologies for vehicle systems
Explore IndustryProdukty konsumenckie i handel detaliczny
Innowacyjność produktów poprzez efektywne zarządzanie zintegrowanymi recepturami, opakowaniami i procesami produkcyjnymi
Dowiedz się więcej o branżyElectronics & Semiconductors
New product development leverages data to improve quality and profitability and reduce time-to-market and costs
Explore IndustryEnergy & Utilities
Supply chain collaboration in design, construction, maintenance and retirement of mission-critical assets
Explore IndustryHeavy Equipment
Construction, mining, and agricultural heavy equipment manufacturers striving for superior performance
Explore IndustryIndustrial Machinery
Integration of manufacturing process planning with design and engineering for today’s machine complexity
Explore IndustryInsurance & Financial
Visibility, compliance and accountability for insurance and financial industries
Explore IndustryMarine
Shipbuilding innovation to sustainably reduce the cost of developing future fleets
Explore IndustryMedia & Telecommunications
Siemens PLM Software, a leader in media and telecommunications software, delivers digital solutions for cutting-edge technology supporting complex products in a rapidly changing market.
Explore IndustryMedical Devices & Pharmaceuticals
“Personalized product innovation” through digitalization to meet market demands and reduce costs
Explore IndustrySmall & Medium Business
Remove barriers and grow while maintaining your bottom line. We’re democratizing the most robust digital twins for your small and medium businesses.
Explore IndustryPCB electrothermal modeling accuracy and thermo-mechanical analysis workflow | Siemens Digital Industries Software
PCB electrothermal modeling accuracy and thermo-mechanical analysis workflow | Siemens Digital Industries Software
Designers of multi-layer complex boards face challenges due to limitations in transferring information between electrical and mechanical design tools, resulting in design changes later in typical workflows to accommodate thermal analysis tests. Teams can verify PCB designs faster with co-simulation and closer ECAD-MCAD electrothermal modeling and design workflows.
Learn about a new co-simulation method combining 3D electronics cooling analysis with a board-level power integrity EDA simulation software used for DC drop analysis. Connect typically separate thermal and DC voltage drop analysis tasks to enable closer ECAD-MCAD electrothermal co-design and better temperature prediction and identify areas of high current density.
Designers decide how to perform thermal modeling of PCBs, whether it is detailed explicit PCB thermal modeling or modeling a PCB as a network assembly. As a network assembly, designers evaluate the precise thermal conductivity and capacity map of layers and internal structure. Deciding when to use the different types of modeling and why can be helpful to gauge the modeling efforts throughout the workflow.
Using data from a co-simulation, designers can leverage thermal analysis results to perform a thermo-mechanical stress analysis task directly within a CAD environment. By integrating this task into existing workflows and tools, teams can realize verified PCB thermal designs faster.
John Wilson
Electronics Product Specialist, Siemens Digital Industries Software
John Wilson has over 20 years of electronics thermal design experience in simulation and testing. John has a BS and MS in Mechanical Engineering from the University of Colorado at Denver and then joined Flomerics in 1999 which was acquired by Mentor Graphics and is now part of Siemens Digital Industries Software. John has managed more than 100+ electronics thermal design consulting projects ranging from component level, PCB, enclosure to system level across of a wide range of applications including consumer products, communications, industrial and automotive electronics. He has developed a practical, comprehensive knowledge of IC package thermal testing and analysis correlation through his work on thermal transient test technology in different applications. John’s experience also encompasses 11+ years of managing teams of engineers performing consulting thermal design projects and supporting clients using simulation and testing tools.
Witaj Bob (zostanie zastąpione prawdziwym imieniem przy wejściu na stronę)
Chcemy dowiedzieć się więcej na Twój temat.
Podczas przesyłania danych wystąpił błąd. Spróbuj ponownie.
Subskrybujesz wiadomości e-mail od firmy Siemens Digital Industries Software po raz pierwszy? Pamiętaj o potwierdzeniu subskrypcji w wiadomości e-mail, którą niebawem otrzymasz.
Witaj Bob (zostanie zastąpione prawdziwym imieniem przy wejściu na stronę)
Masz dostęp do tego webinaru przez 90 dni. Kliknij poniżej, aby rozpocząć oglądanie.
Designers of multi-layer complex boards face challenges due to limitations in transferring information between electrical and mechanical design tools, resulting in design changes later in typical workflows to accommodate thermal analysis tests. Teams can verify PCB designs faster with co-simulation and closer ECAD-MCAD electrothermal modeling and design workflows.
Learn about a new co-simulation method combining 3D electronics cooling analysis with a board-level power integrity EDA simulation software used for DC drop analysis. Connect typically separate thermal and DC voltage drop analysis tasks to enable closer ECAD-MCAD electrothermal co-design and better temperature prediction and identify areas of high current density.
Designers decide how to perform thermal modeling of PCBs, whether it is detailed explicit PCB thermal modeling or modeling a PCB as a network assembly. As a network assembly, designers evaluate the precise thermal conductivity and capacity map of layers and internal structure. Deciding when to use the different types of modeling and why can be helpful to gauge the modeling efforts throughout the workflow.
Using data from a co-simulation, designers can leverage thermal analysis results to perform a thermo-mechanical stress analysis task directly within a CAD environment. By integrating this task into existing workflows and tools, teams can realize verified PCB thermal designs faster.
John Wilson
Electronics Product Specialist, Siemens Digital Industries Software
John Wilson has over 20 years of electronics thermal design experience in simulation and testing. John has a BS and MS in Mechanical Engineering from the University of Colorado at Denver and then joined Flomerics in 1999 which was acquired by Mentor Graphics and is now part of Siemens Digital Industries Software. John has managed more than 100+ electronics thermal design consulting projects ranging from component level, PCB, enclosure to system level across of a wide range of applications including consumer products, communications, industrial and automotive electronics. He has developed a practical, comprehensive knowledge of IC package thermal testing and analysis correlation through his work on thermal transient test technology in different applications. John’s experience also encompasses 11+ years of managing teams of engineers performing consulting thermal design projects and supporting clients using simulation and testing tools.