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Jack
Taylor
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jack_taylor@mentor.com
Aerospace & Defense
Innovation and collaborative, synchronized program management for new programs
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Integration of mechanical, software and electronic systems technologies for vehicle systems
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Innowacyjność produktów poprzez efektywne zarządzanie zintegrowanymi recepturami, opakowaniami i procesami produkcyjnymi
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New product development leverages data to improve quality and profitability and reduce time-to-market and costs
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Shipbuilding innovation to sustainably reduce the cost of developing future fleets
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Siemens PLM Software, a leader in media and telecommunications software, delivers digital solutions for cutting-edge technology supporting complex products in a rapidly changing market.
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Explore IndustrySiemens Digital Industries Software Multiple Mentor product lines now certified on TSMC’s most advanced processes
Siemens Digital Industries Software Multiple Mentor product lines now certified on TSMC’s most advanced processes
Today at the TSMC 2019 Open Innovation Platform® (OIP) Ecosystem Forum, Mentor, a Siemens business, announced a broad array of recently certified tools, compelling new functionalities and other foundry-specific enablement measures on TSMC’s most advanced processes intended to benefit mutual Mentor/TSMC customers and help to further expand TSMC’s growing ecosystem.
TSMC has once again certified Mentor’s Calibre nmDRC™, Calibre nmLVS™, Calibre YieldEnhancer, Calibre PERC™ and Analog FastSPICE (AFS™) Platform, now for the latest version of DRM and SPICE on TSMC’s N5, N7+, N5P and N6 processes. With these certifications, Mentor’s AFS platform now supports the mobile and high-performance computing (HPC) design technologies on TSMC’s process technologies, allowing Mentor customers targeting analog, mixed-signal and radio frequency (RF) designs to verify their chips with confidence in the latest TSMC 5nm and 7nm processes.
“These new certifications on TSMC’s process technologies are very valuable to our growing ecosystem, enabling our customers to achieve successful silicon innovations on the most advanced processes for the mobile and HPC applications,” said Suk Lee, TSMC senior director, Design Infrastructure Management Division. “We’re very pleased with the result of our ongoing collaboration with Mentor in certifying several key products for our most advanced processes, and look forward to the compelling end-products that they will inevitably enable.”
Mentor today also announced that Mentor’s Calibre YieldEnhancer, the platform used for SmartFill functionality, now offers additional features in support of the latest TSMC technologies. Mentor’s added features include easier and simpler modification of fill shapes, together with last-minute ECO (Electronic Change Order) design changes.
“Mentor has a long track record of collaborating with TSMC to establish highly innovative solutions for even the most complex of process technology challenges,” said Joe Sawicki, executive vice president for Mentor’s IC Segment. “Mentor looks forward to continuing its successful partnership with TSMC for the ongoing benefit of our many mutual customers.”
Visit Mentor at TSMC’s North America Forum
Mentor invites engineers planning to attend TSMC’s Open Innovation Platform Ecosystem Forum in Santa Clara to visit booth #608, as well as attend the below Mentor-led technical sessions:
Jack
Taylor
512-560-7143
jack_taylor@mentor.com