Optimizing Electronics Cooling with 3D Printing

온디맨드 웨비나 | 35 분

Increase your air flow efficiency with simulation, design and 3D printing.

3D printing has the potential to improve the efficiency of electronics cooling, leading to more robust equipment designs and longer lifespans.

HP and Siemens partnered on a project to make the cooling ducts in HP printers more efficient. With a combination of simulation, design and 3D printing, the team achieved air flow efficiency improvements of 23%. This webinar will discuss the process and tools used to achieve these improvements.

As electronics become more complicated and space in electronic devices continues to be at a premium, being able to create cooling that is unconstrained by the geometry required for conventional manufacturing becomes a game changer. This is the promise of 3D printing, or additive manufacturing.


  • Gain insight into the robust software and hardware necessary to extract the full potential of 3D printing.
  • Understand why cooling of electronics is often not as efficient as it could be.
  • Learn how simulation, design and 3D printing are the basis for unlocking the potential of efficient electronics cooling.