기사
Interview – Klaus Olesen, Thermal Design Specialist, Danfoss Drives
Klaus Olesen is responsible for developing new cooling technologies for power electronic components and systems which covers thermal, thermo-mechanical and fluid dynamics simulation tools (FEM, CFD), power electronics reliability and lifetime assessment, from concept development to feasibility studies. In this interview, Klaus discusses current trends in thermal design and how to tailor solutions for customers, the evolution of IGBT liquid cooling and the efficiency of Simcenter FLOEFD as a CFD design tool to compress design cycles and achieve accuracy.