Learn more about Opcenter Execution Semiconductor
Data Collection & Acquisition for Semiconductor
Collect and Manage Production Data in Semiconductor Manufacturing
Siemens data collection and acquisition capabilities enable Semiconductor manufacturers to obtain operational production data that is associated with production equipment and processes. It provides real-time statuses of production equipment and processes while registering the whole history of performed operations.
Data Collection & Acquisition for Semiconductor
Siemens data collection and acquisition capabilities enable Semiconductor manufacturers to obtain operational production data that is associated with production equipment and processes. It provides real-time statuses of production equipment and processes while registering the whole history of performed operations.
Learn more about data collection and acquisition capabilities for Semiconductor manufacturing
Data Collection Plan
Definition and management of data collection plans for "pre", "in", and "post" process data collection as well as ad hoc collections on lot, wafer, equipment, and/or tool level. Calculations using collected data or any other data in the system can be used to merge parameters. Limits can be used to guide the operator or automation layer and take action to control the lot and/or equipment.
Data segregation
Data segregation makes it possible to use a central installation with one database supporting different plants to provide operators the visibility of data that belongs to their plant (or area, line.)
Integration with 3rd party systems
An advanced interoperability module with established connectors as well as open API's provide the ability to connect different enterprise or automation systems (ERP, LIMS, QMS, CMMS, Historian, DCS/PCS, SCADA, PLC…), and acquire data in heterogeneous automation environments and shop floor equipment (support of multiple connection protocols).
Manual & Automated Data Acquisition
Capabilities include manual and automatic data acquisition, integration with shop floor equipment, data collection, tracking results, and alerting on process control limits and suspect trends.
Process Automation Controller
The process automation controller allows you to connect the MES to any equipment or controller (e.g. PLC) on the shop floor through a variety of protocols such as SECS/GEM. The flexible platform allows quick deployment through definition of equipment types, configurable logic independent of communication protocol, built in typical scenarios like recipe select and close integration with MES.
Statistical Process Control
Any data collected can be fed into the Statistical Process Control (SPC) solution which can trigger several types of dispositions when out of bounds like put a lot on future hold or sign a tool down to trigger maintenance.
Wafer defect management
Wafer/strip maps (E142 standard) provide graphical representation of locations and die sites within the wafer or strip, along with defect recording and defining bin failures.
