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Siemens Digital Industries Software › › › › Tapeout Management for Semiconductor Devices

Tapeout Management for Semiconductor Devices

Tapeout Management for Semiconductor Devices

A workflow-driven tapeout process ensures the efficiency, data integrity, manufacturability, and on-time delivery of tapeout data, from design to reticle manufacture. Our solution ensures that all necessary validations are conducted, and that intellectual property is checked for accuracy and ownership. Place and route results and logic synthesis are checked as individuals, or in groups as systems, before generating GDSII files for photomask production, allowing you to achieve error-free and on-time results.

A workflow-driven tapeout process ensures the efficiency, data integrity, manufacturability, and on-time delivery of tapeout data, from design to reticle manufacture. Our solution ensures that all necessary validations are conducted, and that intellectual property is checked for accuracy and ownership. Place and route results and logic synthesis are checked as individuals, or in groups as systems, before generating GDSII files for photomask production, allowing you to achieve error-free and on-time results.

Tapeout Management for Semiconductor Devices

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One of the major challenges during the tapeout operation is to orchestrate complex workflows and checklists among internal and external stakeholders. 

The objective of tapeout is to release the mask layout design to manufacturing for the creation of physical photomask reticles, and the current complexity of silicon designs demands that tapeout be flawless in order to meet stringent quality, budget and time requirements.

Since every step of the tapeout workflow consumes and generates data, and failed taped out designs result in highly costly spins, an effective tapeout process is key to avoiding late error discovery and significant increases in costs.

Our solution provides preconfigured workflows that support the end-to-end tapeout process, including the reuse of pre-verified local and third party intellectual property (IP) such as embedded core, memory, interfaces and mixed-signal IP, to mitigate errors and meet a project’s budget and time goals.
Tapeout Management for Semiconductor Devices