Simcenter Micred Quality Tester

Automate semiconductor package thermal quality testing

Simcenter Micred Quality Tester - IC package thermal impedance for automated semiconductor testing

Simcenter Micred Quality Tester enables assessment of semiconductor package thermal structure to identify manufacturing defects, including die attach issues. It uses accurate thermal impedance measurement in combination with automatic test equipment.

Precise measurement of thermal response to a short power pulse allows high throughput semiconductor testing, including for junction to case thermal resistance verification. Junction temperature measurement is via electrical method using built-in Simcenter Micred T3STER technology. As an IC test handler picks and places devices for test, each device is qualified for automated binning compared to a gold standard thermal impedance curve and preset bandings of variation.

Simcenter Micred Quality Tester

Simcenter Micred Quality Tester enables assessment of semiconductor package thermal structure to identify manufacturing defects, including die attach issues. It uses accurate thermal impedance measurement in combination with automatic test equipment.

Precise measurement of thermal response to a short power pulse allows high throughput semiconductor testing, including for junction to case thermal resistance verification. Junction temperature measurement is via electrical method using built-in Simcenter Micred T3STER technology. As an IC test handler picks and places devices for test, each device is qualified for automated binning compared to a gold standard thermal impedance curve and preset bandings of variation.

Simcenter Micred Quality Tester

Discover how to automate semiconductor package thermal quality testing.

オンデマンド・ウェビナー | 47 分

半導体パッケージの熱特性評価 - 熱指標、信頼性、品質

ICパッケージの熱特性評価 - Simcenter T3STER熱過渡試験:  熱抵抗プロファイル vs 熱容量のプロファイル

半導体とICパッケージの熱過渡試験技術を活用

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