Innovazione e gestione dei programmi sincronizzata e collaborativa per i nuovi programmi
The family of thermal characterization hardware solutions provide component and systems suppliers with the ability to accurately and efficiently test, measure and thermally characterize semiconductor integrated circuit packages, single and arrayed LEDs, stacked and multi-die packages, power electronics modules, thermal interface material (TIM) properties, and complete electronic systems.
Our hardware solutions directly measure the actual heating or cooling curves of packaged semiconductor devices continuously and in real time, rather than artificially composing this from the results of several individual tests. Measuring the true thermal transient response in this way is far more efficient and accurate, leading to more accurate thermal metrics than steady-state methods. Measurements only need to be performed once per sample, rather than repeated and an average taken as with steady state methods.
The family of thermal characterization hardware solutions provide component and systems suppliers with the ability to accurately and efficiently test, measure and thermally characterize semiconductor integrated circuit packages, single and arrayed LEDs, stacked and multi-die packages, power electronics modules, thermal interface material (TIM) properties, and complete electronic systems.
Our hardware solutions directly measure the actual heating or cooling curves of packaged semiconductor devices continuously and in real time, rather than artificially composing this from the results of several individual tests. Measuring the true thermal transient response in this way is far more efficient and accurate, leading to more accurate thermal metrics than steady-state methods. Measurements only need to be performed once per sample, rather than repeated and an average taken as with steady state methods.
Our thermal, optical and material characterization solutions and active power cycling hardware all share a common heritage when it comes to accuracy. Using a transient measurement technique, accuracy comes from the use of microvolt resolution measurement channels achieving up to 1 million samples per second, gives extremely high accuracy and resolution of a device’s temperature sensitive parameter, corresponding to a temperature resolution of better than +/- 0.01 degrees Celsius.
Active power cycling hardware provides an industry-unique capability of combining active power cycling with transient thermal characterization and thermal structure investigation using structure functions.
Need text
A requirement of the electrical test method is that the variation in the response of the electrical parameter measured during the test, the temperature sensitive parameter, such as voltage drop across a forward-biased diode. Known as K-factor calibration, this parameter has to be calibrated to accurately determine the variation in value as a function of temperature.
The Electrical Test Method is a non-destructive approach, standardized by JEDEC (JESD51-1), which uses the temperature-dependent properties of a semiconductor device, such as the forward voltage for a diode, to determine its temperature during thermal testing. The die can be both powered and sensed simultaneously throughout the test, to measure temperature vs. time during thermal characterization.
Dedicated test environments are available to provide comprehensive testing solutions. Cold plates and still air chambers are available for testing packaged ICs, for thermal characterization measurements that conform to the JEDEC JESD51-2a still air environment for junction-to-ambient thermal resistance measurement; and the JEDEC JESD51-14 dual interface method for junction-to-case resistance measurement. Integrating spheres are available for testing LEDs to the relevant JEDEC standards and CIE recommendations.
Enter the short summary here - no longer than 75 words. This is the version of the summary that will appear when this Capability is used in a promotion format.
Post processing capabilities for our thermal characterization hardware includes structure function analysis of temperature vs. time data, comparison of Structure Functions of different samples, and simulation correction for the initial electrical transient caused by switching from heating to sensing currents.
Structure Functions and thermal metric values can be exported for use in IC and LED package datasheets, and to calibrate detailed thermal models leading to 99+% model accuracy. Material thermal conductivity values can be exported for use in electronics thermal design software.
A Structure Function, being a distributed Cauer-type Resistor-Capacitor model, can be coarsened to form a discrete stepwise representation of the package as a ladder-type one or two port Compact Thermal Model.Active power testers and thermal conductivity measurement solutions are designed to operate within an engineering production environments in addition to a laboratory setting. Both are supported by a workflow-dedicated software that automates the process of taking the measurements.
Material thermal conductivity measurements can automatically measure a material sample at a series of different thicknesses or pressures to calculate its thermal conductivity automatically after the initial setup.