Simcenter Micred Quality Tester enables assessment of semiconductor package thermal structure to identify manufacturing defects, including die attach issues. It uses accurate thermal impedance measurement in combination with automatic test equipment.
Precise measurement of thermal response to a short power pulse allows high throughput semiconductor testing, including for junction to case thermal resistance verification. Junction temperature measurement is via electrical method using built-in Simcenter Micred T3STER technology. As an IC test handler picks and places devices for test, each device is qualified for automated binning compared to a gold standard thermal impedance curve and preset bandings of variation.
