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PCB electrothermal modeling accuracy and thermo-mechanical analysis workflow
Designers of multi-layer complex boards face challenges due to limitations in transferring information between electrical and mechanical design tools, resulting in design changes later in typical workflows to accommodate thermal analysis tests. Teams can verify PCB designs faster with co-simulation and closer ECAD-MCAD electrothermal modeling and design workflows.
Co-simulation method combining 3D electronics cooling analysis and DC drop analysis
Learn about a new co-simulation method combining 3D electronics cooling analysis with a board-level power integrity EDA simulation software used for DC drop analysis. Connect typically separate thermal and DC voltage drop analysis tasks to enable closer ECAD-MCAD electrothermal co-design and better temperature prediction and identify areas of high current density.
Reviewing detailed explicit PCB thermal modeling vs PCB as a network assembly
Designers decide how to perform thermal modeling of PCBs, whether it is detailed explicit PCB thermal modeling or modeling a PCB as a network assembly. As a network assembly, designers evaluate the precise thermal conductivity and capacity map of layers and internal structure. Deciding when to use the different types of modeling and why can be helpful to gauge the modeling efforts throughout the workflow.
Leverage thermal analysis results in CAD environments to perform thermo-mechanical stress analysis tasks
Using data from a co-simulation, designers can leverage thermal analysis results to perform a thermo-mechanical stress analysis task directly within a CAD environment. By integrating this task into existing workflows and tools, teams can realize verified PCB thermal designs faster.
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