Innovación y gestión de programas colaborativa y sincronizada para nuevos programas
La gestión térmica es un aspecto fundamental a tener en cuenta en una gran variedad de productos, como la maquinaria industrial, los vehículos y la electrónica de consumo. El objetivo de cualquier solución de gestión térmica es mantener la temperatura del producto dentro de un intervalo óptimo para su rendimiento. Sin embargo, conseguirlo puede implicar la adición o la extracción del calor, ya sea de forma activa o pasiva, algo que puede evaluarse mediante un software de simulación térmica.
Simcenter incluye las funciones de simulación térmica más exhaustivas y avanzadas, que le ayudarán a entender las características térmicas de su producto y, por consiguiente, adaptar la solución de gestión térmica para obtener un rendimiento óptimo.
La gestión térmica es un aspecto fundamental a tener en cuenta en una gran variedad de productos, como la maquinaria industrial, los vehículos y la electrónica de consumo. El objetivo de cualquier solución de gestión térmica es mantener la temperatura del producto dentro de un intervalo óptimo para su rendimiento. Sin embargo, conseguirlo puede implicar la adición o la extracción del calor, ya sea de forma activa o pasiva, algo que puede evaluarse mediante un software de simulación térmica.
Simcenter incluye las funciones de simulación térmica más exhaustivas y avanzadas, que le ayudarán a entender las características térmicas de su producto y, por consiguiente, adaptar la solución de gestión térmica para obtener un rendimiento óptimo.
Consider boiling phenomena in your heat transfer applications with wall and bulk boiling models, improving accuracy of heat transfer and phase-change simulation in your application.
Thermal conduction occurs when heat transfers through a solid, from the higher-temperature to lower-temperature regions. This happens spontaneously, and continues until a state of thermal equilibrium is attained. Typical examples of conduction in everyday life include the handle of a pot of boiling water getting hot, the increase in temperature of the outer wall of a copper pipe as hot water passes through it, or the spontaneous chill you experience when you consume a spoonful of ice cream.
Understanding conduction behavior can help you design safer, more dependable and better performing products. Simcenter places robust conductive heat transfer analysis capabilities at your fingertips.
Convection is a major heat transfer pathway that is present in a wide range of applications, processes and natural phenomena. Many products rely on a robust heat management strategy for optimal performance and durability. Optimizing convective heat transfer in these devices, either by strategic placement of components or the use of other working fluids, is a complex problem. Simcenter offers robust capabilities for addressing convection in the design of products.
The comprehensive heat transfer models in Simcenter extend to solid energy models including conduction in solid shells and exothermic solids.
Simcenter offers single and dual stream heat exchanger models to model the heat transfer between two fluid streams
Some types of thermal simulation involve a change in state of materials. Examples include freezing of water on a cold windshield, de-fogging of interior volumes, and condensation and boiling that may occur where a fluid meets a structural boundary. Simcenter provides advanced capabilities to account for phase change in thermal and fluid-thermal simulations.
Radiative heat transfer occurs when objects radiate electromagnetic energy due to temperature. This energy, typically located in the infra-red region of the wave spectrum, is also known as thermal radiation.
Simcenter provides you with capabilities to solve most complex problems involving radiative heat transfer.
Understand and predict thermal physics for space-bound, orbiting and interplanetary vehicles. Use a comprehensive set of tools to perform orbital thermal analyses to resolve engineering challenges early in the design process.
Thermal loads will usually result in stresses in components that add to the stresses resulting from other types of loads such as contact, force, and pressure. Thermal stresses are caused by changes in temperature in a structure where expansion or contraction is constrained. Simcenter includes advanced capabilities for evaluating thermo-mechanical stress in structures.
Model preparation can account for up to 80 percent of the overall CAE process. This is often the result of tedious geometry clean-up and preparation. Simcenter offers sophisticated capabilities for model preparation including surface wrapping techniques for extracting fluid volumes and for boundary layer meshing.
A simplified approach for simulating ice or fog layer formation, thickness and distribution, offering quick results with minimal turnaround time. Applications include deicing and defogging.
Siemens Digital Industries Software services and solution enable ThermoLift to integrate automated design optimization, allowing simulation to drive the design process
See all Success StoriesCómo aplicar ensayos transitorios térmicos, simulación de refrigeración electrónica y calibración precisa del modelo para mejorar el diseño térmico
Learn more about the benefits and capabilities of Simcenter 3D Thermal Multiphysics simulation.
Optimize your overall heavy machine powertrain thermal system design using simulation
Descubra cómo modelar las vías térmicas con precisión y velocidad con el fin de facilitar su proceso de diseño térmico de la placa de circuito impreso