Aerospace & Defense
Innovation and collaborative, synchronized program management for new programs
Innovation and collaborative, synchronized program management for new programsExplore Industry
Integration of mechanical, software and electronic systems technologies for vehicle systemsExplore Industry
Product innovation through effective management of integrated formulations, packaging and manufacturing processesExplore Industry
New product development leverages data to improve quality and profitability and reduce time-to-market and costsExplore Industry
Supply chain collaboration in design, construction, maintenance and retirement of mission-critical assetsExplore Industry
Integration of manufacturing process planning with design and engineering for today’s machine complexityExplore Industry
Visibility, compliance and accountability for insurance and financial industriesExplore Industry
Shipbuilding innovation to sustainably reduce the cost of developing future fleetsExplore Industry
Siemens PLM Software, a leader in media and telecommunications software, delivers digital solutions for cutting-edge technology supporting complex products in a rapidly changing market.Explore Industry
“Personalized product innovation” through digitalization to meet market demands and reduce costsExplore Industry
Faster time to market, fewer errors for Software DevelopmentExplore Industry
Remove barriers and grow while maintaining your bottom line. We’re democratizing the most robust digital twins for your small and medium businesses.Explore Industry
A Complete Guide to Enclosure Thermal Design - 14 Key Considerations
Designing an enclosure to ensure heat is dissipated efficiently away from electronics to the surroundings is important to keep components within suitable temperatures to ensure product performance and reliability.
Learn how to improve enclosure design in this guide covering 14 considerations on thermal management best practices, from cooling options and selection through to design considerations. Examples are presented using CFD simulation results to illustrate the need to understand airflow and heat transfer within electronics enclosures.
Areas of design to focus on for advantages in cooling efficiency are illustrated and also where tradeoff decisions need to be made. This guide aids engineers designing enclosures for various applications from consumer tablets and smartphones, to automotive electronics and avionics, through to servers and data centers.
Please contact us to supply this material directly to you and include any questions you have on electronics thermal simulation and thermal testing.
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