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Automating the stencil customization process for shortened lead times and reduced soldering errors

As the industry continues the trend toward high-mix, low-volume production, electronics manufacturing companies must realign engineering practices to reduce costs and remain competitive. Standardizing the engineering approach to production with digital transformation was essential for SRXGlobal to manage high-mix production effectively.

After printing parameters and solder paste application, the stencil is the third most important factor that influences the quality of the solder paste deposit. Since a bad stencil can result in defects on all printed boards, minimizing errors helps improve NPI time and reduces costs.

Use Digitalization for Cost Reduction to Deliver Competitive High-Mix Production

To achieve its digitalization and standardization goals and with the help of Siemens' Australian partner ONBoard Solutions, SRX implemented the Valorâ„¢ Process Preparation software stencil module. The stencil module simplifies and quickens the stencil customization process, reducing NPI and costs in the process. Learn how in the case study.

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