Evaluating delamination of power modules using new testing methodology – the Yamaha case

Thermal fatigue characteristics of solder and PCB reliability can be evaluated using temperature cycling tests that subject the solder to repetitive cycles of high and low-temperature conditions. Still these test cycles can require several months in a laboratory.

In this article, we introduce how Yamaha Motor Company sought to accelerate test methods to detect and prevent the delamination of power modules products to speed up overall product development. The company developed a methodology using the Simcenter T3STER test solution to quantify the process of solder crack development more sensitively and more quickly than any other method.