Skip to Content
White paper

Achieve higher accuracy in electronics cooling simulation with measurement and calibration

Often a typical 3D electronics cooling simulation of an electronic system assumes that all power is dissipated in the semiconductor components. In the case of products with high-current power packages or modules, the power dissipation in the electrical distribution network has become a significant factor. Power dissipation in the copper traces and connections can be in the range of 30 percent of total input power, so it is essential to consider this heating effect in the simulation for highest accuracy prediction in complex, power dense electronics.

This whitepaper considers factors for higher accuracy for modeling trace and connection heat dissipation within simulation. It illustrates thermal measurement of an IGBT module using Simcenter T3STER and model calibration in conjunction with thermal simulation in Simcenter Flotherm.


Fill out the form to get access

We're Sorry!

There was an error with the page submission. Please try again.

Thank you for downloading

The resource is now available for download.

Field is required A valid email address is required
Field is required Invalid value or too long
Field is required Invalid value or too long
Field is required Invalid value or too long
Field is required Invalid value or too long
Field is required Please add a valid phone number
Field is required Invalid value or too long
Field is required Invalid value or too long
Field is required Invalid value or too long

Field is required
Field is required Invalid value or too long
Field is required Invalid value or too long
Field is required Invalid value or too long