Executives focus on lowering costs while maintaining and growing short-term productivity to drive many of their high-level initiatives. Digital transformation is central to many research and development (R&D) efficiency initiatives to target speed, agility, quality, and increased new product introduction (NPI) success with lower risk. Design and manufacturing leaders face the challenge of comparing tools and systems to understand the real value of change. We must identify a transformation that can overhaul our current methodologies to improve our productivity. This white paper looks at 10 areas that electronic and mechanical designers working with printed circuit boards (PCBs) face the dysfunctional nature of their collaborative tools.
Simulation driven design solves PCB design dysfunction and integrates ECAD and MCAD engineering
This white paper looks at 10 areas where electronic and mechanical designers working with printed circuit boards (PCBs) face the dysfunctional nature of their collaborative tools. Leverage the powerful capabilities in NX and Siemens Xpedition for solutions to the following:
- External and internal copper and solder mask/silkscreen data
- True 3D model exchange and synchronization (pin 1 verification)
- Full 3D Interference checking
- Rigid-flex objects (multiple thickness boards, stiffeners, etc.)
- High density interconnects and miniaturization
- Variant exchange
- Design intent collaboration (ownership, frozen groups)
- Workflow synchronization
PCB design solutions provide cost savings and productivity gains
Electronics designers and manufacturers face a considerable challenge to find systems that provide a significant advantage. With the mechanical design power of NX and the innovative PCB design solutions in Xpedition, product designers and engineers have the tools to revolutionize their workflow. The cohesive solutions found within NX and Xpedition provide efficiency, cost savings and productivity gains that extend across organizations. Download the white paper to learn more.