Thermal conduction occurs when heat transfers through a solid, from the higher-temperature to lower-temperature regions. This happens spontaneously, and continues until a state of thermal equilibrium is attained. Typical examples of conduction in everyday life include the handle of a pot of boiling water getting hot, the increase in temperature of the outer wall of a copper pipe as hot water passes through it, or the spontaneous chill you experience when you consume a spoonful of ice cream.

Understanding conduction behavior can help you design safer, more dependable and better performing products. Simcenter places robust conductive heat transfer analysis capabilities at your fingertips.

The comprehensive heat transfer models in Simcenter extend to solid energy models including conduction in solid shells and exothermic solids.

Some types of thermal simulation involve a change in state of materials. Examples include freezing of water on a cold windshield, de-fogging of interior volumes, and condensation and boiling that may occur where a fluid meets a structural boundary. Simcenter provides advanced capabilities to account for phase change in thermal and fluid-thermal simulations.

Understand and predict thermal physics for space-bound, orbiting and interplanetary vehicles.  Use a comprehensive set of tools to perform orbital thermal analyses to resolve engineering challenges early in the design process.

Model preparation can account for up to 80 percent of the overall CAE process. This is often the result of tedious geometry clean-up and preparation. Simcenter offers sophisticated capabilities for model preparation including surface wrapping techniques for extracting fluid volumes and for boundary layer meshing.