Skip to Content

Thermal characterization hardware

T3STER

Simcenter T3STER (pronounced "Tris-ter") is an advanced non-destructive transient thermal tester for thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices, capable of testing components in situ. A proprietary system consisting of software and hardware, our solution supports the semiconductor, transportation, consumer electronics and LED markets.

Measuring the true thermal transient response is far more efficient than steady-state methods. Measurements are to ±0.01° C with up to 1-microsecond time resolution, producing accurate thermal metrics. Structure functions post-process the response into a plot that shows the thermal resistance and capacitance of package features along the heat flow path. Failures in the structure, such as faults in the die-attach failures are easily understood, making this an ideal pre- and post-stress failure detection tool in reliability analysis. Measurements can be exported for thermal model calibration, underpinning the accuracy of the thermal design effort.

Read More:

6 Key Benefits of Semiconductor Transient Thermal Testing

Whitepaper: Introduction to Structure Functions for Electronics Thermal Characterization

What is a Structure Function? - T3STER Semiconductor Characterization

Simcenter T3STER

Simcenter T3STER (pronounced "Tris-ter") is an advanced non-destructive transient thermal tester for thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices, capable of testing components in situ. A proprietary system consisting of software and hardware, our solution supports the semiconductor, transportation, consumer electronics and LED markets.

Measuring the true thermal transient response is far more efficient than steady-state methods. Measurements are to ±0.01° C with up to 1-microsecond time resolution, producing accurate thermal metrics. Structure functions post-process the response into a plot that shows the thermal resistance and capacitance of package features along the heat flow path. Failures in the structure, such as faults in the die-attach failures are easily understood, making this an ideal pre- and post-stress failure detection tool in reliability analysis. Measurements can be exported for thermal model calibration, underpinning the accuracy of the thermal design effort.

Read More:

6 Key Benefits of Semiconductor Transient Thermal Testing

Whitepaper: Introduction to Structure Functions for Electronics Thermal Characterization

What is a Structure Function? - T3STER Semiconductor Characterization

Event | 03 November 2020 |

Realize LIVE Europe

A virtual destination for users to innovate, collaborate and problem-solve to drive digital transformation. Realize LIVE Europe brings together multiple industries, communities and conferences into one event.

Don't miss your opportunity to participate in two days of engaging content, networking and building those meaningful connections at the NEW Realize LIVE Europe virtual conference. Enhance your knowledge and proficiency with the tools you have, learn from the thought leadership and customer stories that will help guide your organization's continued digital transformation.

Register for the event