Simcenter T3STER

Characterize the thermal properties of components

T3STER

Simcenter T3STER is an advanced non-destructive transient thermal tester for thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices. It measures the true thermal transient response more efficiently than steady-state methods. Measurements are to ±0.01° C with up to 1-microsecond time resolution. Structure functions post-process the response into a plot that shows the thermal resistance and capacitance of package features along the heat flow path. Simcenter T3STER is an ideal pre- and post-stress failure detection tool. The measurements can be exported for thermal model calibration, underpinning the accuracy of the thermal design effort. 

Simcenter T3STER

Simcenter T3STER is an advanced non-destructive transient thermal tester for thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices. It measures the true thermal transient response more efficiently than steady-state methods. Measurements are to ±0.01° C with up to 1-microsecond time resolution. Structure functions post-process the response into a plot that shows the thermal resistance and capacitance of package features along the heat flow path. Simcenter T3STER is an ideal pre- and post-stress failure detection tool. The measurements can be exported for thermal model calibration, underpinning the accuracy of the thermal design effort. 

On-Demand Webinar | 47 minutes

Semiconductor package thermal characterization – thermal metrics, reliability to quality

IC package thermal characterization - Simcenter T3STER thermal transient testing:  thermal resistance vs. thermal capacitance

Leveraging semiconductor and ic package thermal transient test technology

Watch the webinar