Simcenter T3STER is an advanced non-destructive transient thermal tester for thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices. It measures the true thermal transient response more efficiently than steady-state methods. Measurements are to ±0.01° C with up to 1-microsecond time resolution. Structure functions post-process the response into a plot that shows the thermal resistance and capacitance of package features along the heat flow path. Simcenter T3STER is an ideal pre- and post-stress failure detection tool. The measurements can be exported for thermal model calibration, underpinning the accuracy of the thermal design effort.
Simcenter T3STER
Characterize the thermal properties of components
Simcenter T3STER
Simcenter T3STER is an advanced non-destructive transient thermal tester for thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices. It measures the true thermal transient response more efficiently than steady-state methods. Measurements are to ±0.01° C with up to 1-microsecond time resolution. Structure functions post-process the response into a plot that shows the thermal resistance and capacitance of package features along the heat flow path. Simcenter T3STER is an ideal pre- and post-stress failure detection tool. The measurements can be exported for thermal model calibration, underpinning the accuracy of the thermal design effort.
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