Innovationen und bereichsübergreifendes, synchronisiertes Programmmanagement
Luft- und Raumfahrt
Innovationen und bereichsübergreifendes, synchronisiertes Programmmanagement
Mehr Informationen zur BrancheAutomobil- und Transportbranche
Integration der Mechanik-, Software- und Elektroniksystementwicklung für den Einsatz in Fahrzeugsystemen
Mehr Informationen zur BrancheKonsumprodukte und Einzelhandel
Produktinnovation durch effektives Management integrierter Konfektions-, Verpackungs- und Fertigungsprozesse
Mehr Informationen zur BrancheElektronik und Halbleiter
Nutzung vorhandener Daten bei der Entwicklung neuer Produkte, um Qualität und Rentabilität zu steigern sowie gleichzeitig Markteinführungszeiten und Kosten zu reduzieren
Mehr Informationen zur BrancheEnergie und Versorgungsunternehmen
Zusammenarbeit in der Versorgungskette hinsichtlich Konstruktion, Bau, Wartung und Stilllegung von Energie- und Versorgungsanlagen
Mehr Informationen zur BrancheHeavy Equipment
Construction, mining, and agricultural heavy equipment manufacturers striving for superior performance
Explore IndustryIndustriemaschinen und Schwermaschinen
Integration von Konstruktion und Entwicklung für die Fertigungsprozessplanung der heutigen Maschinenkomplexität
Mehr Informationen zur BrancheInsurance & Financial
Visibility, compliance and accountability for insurance and financial industries
Explore IndustryMaritime Industrie
Innovativer Schiffbau, um die Kosten für die Entwicklung zukünftiger Flotten nachhaltig zu senken
Mehr Informationen zur BrancheMedia & Telecommunications
Siemens PLM Software, a leader in media and telecommunications software, delivers digital solutions for cutting-edge technology supporting complex products in a rapidly changing market.
Explore IndustryMedizinische Instrumente und Arzneimittel
Personalisierte Produktinnovation durch Digitalisierung, um der Marktnachfrage gerecht zu werden und die Kosten zu senken
Mehr Informationen zur BrancheSmall & Medium Business
Remove barriers and grow while maintaining your bottom line. We’re democratizing the most robust digital twins for your small and medium businesses.
Explore IndustryAssessing variability influence on electronics thermal reliability using thermal analysis
Assessing variability influence on electronics thermal reliability using thermal analysis
Combining design space exploration and electronics thermal analysis
The traditional use of electronics thermal analysis in its basic function has always been to assess whether a design will adequately ensure maximum temperatures are not exceeded. Improving a design to meet a performance goal using parametric studies and optimization techniques is widely recognized. Even assessing mission profiles using transient simulation is now more prevalent for power management studies or to generate temperature cycling insights.
How many thermal simulation-based design processes today are typically assessing the wide influence of variability from either manufacturing defects or to help quantify impacts of simulation input variations? This on-demand webinar explores the use of electronics thermal analysis combined with statistical design space exploration tools.
Typical electronics cooling simulation studies include multiple design inputs that may be subject to variability e.g data sheet interpretation, material property variation, incorporation of engineering judgment.
Understanding how the thermal performance changes as uncertainties are quantified through statistics will result in more reliable electronics systems
By combining electronics cooling thermal simulation with statistical approaches, engineers can more fully explore the design space. They can also apply analysis to evaluating potential impacts of certain manufacturing quality variation or defects. This on-demand presentation introduces an approach to simulation-based assessment of variations in manufacturing that can influence field reliability of an electronics product.
Studies performed shown in this presentation include Design of Experiments and Monte Carlo methods
A 3D thermal simulation model can provide more insight if it is exercised beyond the nominal input values. Surrogate modeling provides a method to guide an electronics thermal design within the time constraints of a typical design process.
An example is included in this recorded technical presentation looking at the impact of different sizes of TIM material defect, position and variations in thermal conductivity that then influence the operating junction temperature of a package.
Similar approaches to this example can be used to explore variation in thermal bondline performance by evaluating surface flatness, voiding, material performance and TIM degradation over lifetime due to cycling.
Hallo Bob (will be replaced with real first name during the actual website visit)
Wir möchten gerne mehr über Sie erfahren.
Es ist ein Fehler bei der Seitenübermittlung aufgetreten. Bitte versuchen Sie es noch einmal.
Melden Sie sich zum ersten Mal für E-Mails von Siemens Digital Industries Software an? Achten Sie darauf, dass Sie in der E-Mail, die Sie in Kürze erhalten werden, Ihre Zustimmung bestätigen.
Hallo Bob (will be replaced with real first name during the actual website visit)
Sie können 90 Tage lang auf dieses Webinar zugreifen. Klicken Sie bitte unten, um die Anzeige zu starten.
Combining design space exploration and electronics thermal analysis
The traditional use of electronics thermal analysis in its basic function has always been to assess whether a design will adequately ensure maximum temperatures are not exceeded. Improving a design to meet a performance goal using parametric studies and optimization techniques is widely recognized. Even assessing mission profiles using transient simulation is now more prevalent for power management studies or to generate temperature cycling insights.
How many thermal simulation-based design processes today are typically assessing the wide influence of variability from either manufacturing defects or to help quantify impacts of simulation input variations? This on-demand webinar explores the use of electronics thermal analysis combined with statistical design space exploration tools.
Typical electronics cooling simulation studies include multiple design inputs that may be subject to variability e.g data sheet interpretation, material property variation, incorporation of engineering judgment.
Understanding how the thermal performance changes as uncertainties are quantified through statistics will result in more reliable electronics systems
By combining electronics cooling thermal simulation with statistical approaches, engineers can more fully explore the design space. They can also apply analysis to evaluating potential impacts of certain manufacturing quality variation or defects. This on-demand presentation introduces an approach to simulation-based assessment of variations in manufacturing that can influence field reliability of an electronics product.
Studies performed shown in this presentation include Design of Experiments and Monte Carlo methods
A 3D thermal simulation model can provide more insight if it is exercised beyond the nominal input values. Surrogate modeling provides a method to guide an electronics thermal design within the time constraints of a typical design process.
An example is included in this recorded technical presentation looking at the impact of different sizes of TIM material defect, position and variations in thermal conductivity that then influence the operating junction temperature of a package.
Similar approaches to this example can be used to explore variation in thermal bondline performance by evaluating surface flatness, voiding, material performance and TIM degradation over lifetime due to cycling.
Kontaktaufnahme
Technischer Produkt-Support
Kommunikationspräferenzen
Weltweite Standorte