A model-based system engineering approach to advanced semiconductor package design

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Enroll in the webinar and check what the specialist Andras Vass-Varnai and Garrett Wyatt have to say about the semiconductors market

A system engineering approach to advanced semiconductor package design
Semiconductor companies are looking at new, system-level approaches as continued efforts to keep up with Moore’s law increase price and design complexity. At the same time, the demand for computational power and the widespread applications of edge computing creates enormous pressure on the industry. All the while, semiconductor companies must not increase product time to market, give up on profit margins, or sacrifice quality. This leads to advanced packaging being more critical than ever, and we are seeing packaging complexity increase exponentially with 2.5D/3D designs. So, just like the aerospace companies before them, the semiconductor industry must adopt a model-based system engineering approach that emphasizes an integrated product design workflow.

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