3D modeling technology constantly needs to evolve to satisfy industry trends like additive manufacturing, 3D scanning and cloud computing without sacrificing quality and performance. At the same time, software vendors are under pressure to offer better data exchange capabilities for share and reuse of product data across different applications.
Join us on Tuesday November 28 at 08:00 (PST) to learn about the latest advances in Parasolid and HOOPS Exchange and discover how we have integrated these leading solutions so you can deliver unmatched modeling and data exchange capabilities in your applications, including:
Speakers: