Přejít k obsahu
Full-circuit 3D electro-thermal modeling

Achieve higher accuracy in electronics cooling simulation with measurement and calibration

Often a typical 3D electronics cooling simulation of an electronic system assumes that all power is dissipated in the semiconductor components. In the case of products with high-current power packages or modules, the power dissipation in the electrical distribution network has become a significant factor. Power dissipation in the copper traces and connections can be in the range of 30 percent of total input power, so it is essential to consider this heating effect in the simulation for highest accuracy prediction in complex, power dense electronics.

This whitepaper considers factors for higher accuracy for modeling trace and connection heat dissipation within simulation. It illustrates thermal measurement of an IGBT module using Simcenter T3STER and model calibration in conjunction with thermal simulation in Simcenter Flotherm.

Whitepaper Download

Sorry, something went wrong

Looks like there was an error with the page. Please try your download again.

First time signing up? Please be sure to confirm your opt-in with the email you'll receive shortly.


Notice: By supplying my contact information, I authorize Siemens Digital Industries Software and its affiliates to contact me via email, phone, and postal mail about its products and services as described in our consent declaration. Please visit our privacy policy and manage your preferences.


Thank you for downloading

You have successfully downloaded this electronics thermal management whitepaper

Related Resource