Within a single CFD software environment, Simcenter empowers users to simulate not only a broad range of physics but also a broad range of body and mesh motions to accurately capture your physics. With our motion models for CFD simulations, you can simulate real-world performance of moving, overlapping objects with overset meshing, predict dynamic 6-DOF motion of bodies, understand multi-physics interactions to model performance ‘as installed’, easily drive geometric changes for design exploration, easily predict rotating/translating machine behavior and define sophisticated motions to accurately replicate machine operations.

The discrete element method (DEM) can be used to simulate the motion of a large number of interacting discrete objects (particles), such as the granular flow of aggregates, food particles, metal powders, tablets and capsules, and wheat or grass. Simcenter is the first commercial engineering simulation tool to include a DEM capability that is fully coupled with numerical flow simulation.

Computational rheology is used to model non-Newtonian or viscoelastic materials in industrial problems. The rheology solver accurately resolves the dominant physics of complex rheological material flow and helps predict their behavior.

Flow induced noise is a significant component of the acoustic signature of a vehicle (or other product). Simcenter offers an extensive library of accurate models for predicting aeroacoustics noise sources, including: steady state models, direct models (DES/LES), propagation models and acoustic perturbation equations (APE) solver. 

Simcenter supports hybrid aero-acoustic methods in which at first, a CFD simulation is used for capturing flow turbulences, which are translated into aero-acoustic sources to be plugged into a second acoustic (FEM) simulation model. The latter then predicts the acoustic propagation of these sources, including reflections and absorption in the environment. As such, for instance the cooling noise of electronic equipment of the HVAC noise in a car can be predicted.

Couple to other simulation tools through dedicated interfaces, or an intuitive API. This enables the multi-physics simulations with different time scales ranging from microseconds to thousands of seconds, providing faster and more accurate analyses and shorter turnover times for development and assessment of complex designs

Rather than just simulating a single operating point, explore how your product performs over the full range of operating conditions that it will face during its working life, and employ intelligent design exploration to discover better designs faster.

Thermal design of electronics is critical to developing reliable products that meet cost and performance goals. With increasing complexity, miniaturization, and higher power density, engineers must predict temperature and fluid flow accurately and evaluate cooling from early development stages to design efficient thermal management solutions for heat dissipation.

The Simcenter portfolio includes leading computational fluid dynamics software with specific electronics cooling simulation capabilities for chip package level, PCB, rack and enclosures to large datacenters. Simcenter supports faster time to market, eliminating board re-spins and reducing prototyping costs, for air and liquid cooled electronics by modeling convection, conduction, radiation and solar loading. Simcenter thermal test solutions support package thermal model calibration to achieve highest accuracy.

The computational fluid dynamics (CFD) capability in Simcenter offers an efficient and accurate set of fluid dynamics models and solvers with excellent parallel performance and scalability. It provides a solid foundation for multidisciplinary design exploration.

Almost all real-world engineering problems ultimately depend on the interaction between fluids and solid structures. Simcenter STAR-CCM+ offers both finite volume (FV)-based computational fluid dynamics and finite element (FE)-based computational solid mechanics (CSM) in an easy-to-use single integrated user interface. Using this approach you can solve static, quasi-static, and dynamic problems including those with nonlinear geometry and multiple parts using bonded and small sliding contacts.