Accurately representing the physical behavior of the different fluid and solid phases is key to capturing the real-world performance of your product. Simcenter offers a variety of both Eulerian and Lagrangian modeling capabilities to suit your simulation needs.

Získejte informace o interakcích mezi turbulentním proudovým polem a související chemií toků reaktantů. Simcenter vám pomůže dosáhnout ideálního kompromisu mezi výkonem a emisemi vašeho zařízení za různých provozních podmínek.

Flow induced noise is a significant component of the acoustic signature of a vehicle (or other product). Simcenter  offers an extensive library of accurate models for predicting aeroacoustics noise sources, including: steady state models, direct models (DES/LES), propagation models and acoustic perturbation equations (APE) solver. 

Simcenter supports hybrid aero-acoustic methods in which at first, a CFD simulation is used for capturing flow turbulences, which are translated into aero-acoustic sources to be plugged into a second acoustic (FEM) simulation model. The latter then predicts the acoustic propagation of these sources, including reflections and absorption in the environment. As such, for instance the cooling noise of electronic equipment of the HVAC noise in a car can be predicted.

Couple to other simulation tools through dedicated interfaces, or an intuitive API. This enables the multi-physics simulations with different time scales ranging from microseconds to thousands of seconds, providing faster and more accurate analyses and shorter turnover times for development and assessment of complex designs

Rather than just simulating a single operating point, explore how your product performs over the full range of operating conditions that it will face during its working life, and employ intelligent design exploration to discover better designs faster.

Thermal design of electronics is critical to developing reliable products that meet cost and performance goals. With increasing complexity, miniaturization, and higher power density, engineers must predict temperature and fluid flow accurately and evaluate cooling from early development stages to design efficient thermal management solutions for heat dissipation.

The Simcenter portfolio includes leading computational fluid dynamics software with specific electronics cooling simulation capabilities for chip package level, PCB, rack and enclosures to large datacenters. Simcenter supports faster time to market, eliminating board re-spins and reducing prototyping costs, for air and liquid cooled electronics by modeling convection, conduction, radiation and solar loading. Simcenter thermal test solutions support package thermal model calibration to achieve highest accuracy.

The computational fluid dynamics (CFD) capability in Simcenter offers an efficient and accurate set of fluid dynamics models and solvers with excellent parallel performance and scalability. It provides a solid foundation for multidisciplinary design exploration.

Almost all real-world engineering problems ultimately depend on the interaction between fluids and solid structures. Simcenter STAR-CCM+ offers both finite volume (FV)-based computational fluid dynamics and finite element (FE)-based computational solid mechanics (CSM) in an easy-to-use single integrated user interface. Using this approach you can solve static, quasi-static, and dynamic problems including those with nonlinear geometry and multiple parts using bonded and small sliding contacts.