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NX Nastran Sets New Benchmark in its Category, Solving the Largest and Fastest Known Calculation
FOR RELEASE Monday, February 20, 2006
DARATECH SUMMIT 2006, CAMBRIDGE, Mass. – UGS Corp., a leading global provider of product lifecycle management (PLM) software and services, today announces new NX™ Nastran® customers, and that NX Nastran set anew benchmark in its category by solving a 200 million degrees of freedom (MDOF) model - the largest and fastest known calculation of this type.
“This breakthrough extends our leadership in high performance computing,” said UGS Chairman, CEO and President Tony Affuso, who will announce the initiative during his keynote address today at the Daratech Summit 2006 event. “NX Nastran is a core element of our Lifecycle Simulation strategy to enable real-time simulation across the product lifecycle. We expect NX Nastran to solve problems up to a billion degrees of freedom in the near future. Its scalability and speed significantly improve productivity for our customers, enabling faster idea validation and accelerated innovation.”
New Q4 2005 NX Nastran Customers
Technology Specifics
The analysis was conducted to simulate the behavior of a wing structure under shear load conditions. NX Nastran executed the linear static analysis of a 200 MDOF model that was comprised of over 34 million quadrilateral shell elements and approximately 35 million node points. The solution was obtained in seven hours of elapsed time during which 4.2 tera-bytes of input/output was processed using eight processors in shared memory parallel paradigm. The highest amount of memory used was 20 giga-bytes and the disk space required was 971 giga-bytes. These numbers represent an extraordinary breakthrough in the implicit finite element analysis industry.
The analysis was executed on a just announced IBM System p5 570 with 16 POWER5+™ processors running at 2.2 GHz and 128 GB of DDR2 memory. The 1.4 tera-byte scratch file system was striped over 19 internal 15k rpm disks.
By combining several of the machines into a cluster and utilizing NX Nastran’s industry leading distributed numerical technology known as Hierarchic Distributed Memory Parallel (HDMP), NX Nastran will be able to solve similar problems up to a billion degrees of freedom in the near future.
For more information, visitwww.ugs.com/go/nxsimulation.
About UGS
UGS is a leading global provider of product lifecycle management (PLM) software and services with nearly 4 million licensed seats and 46,000 customers worldwide. Headquartered in Plano, Texas, UGS’ vision is to enable a world where organizations and their partners collaborate through global innovation networks to deliver world-class products and services while leveraging UGS’ open enterprise solutions, fulfilling the mission of enabling them to transform their process of innovation.
Note: UGS, I-Deas, NX, and Transforming the process of innovation are trademarks or registered trademarks of UGS Corp. or its subsidiaries in the United States and in other countries. Nastran is a registered mark of NASA. NASCAR is a trademark or registered mark of National Association for Stock Car Auto Racing, Inc. or its subsidiaries in the United States and in other countries. All other trademarks, registered trademarks or service marks belong to their respective holders.
The statements in this news release that are not historical statements, including statements regarding expected benefits of the product, adoption by customers, continued innovation and other statements identified by forward looking terms such as "may," "will," "expect," "plan," "anticipate" or "project," are forward-looking statements. These statements are subject to numerous risks and uncertainties which could cause actual results to differ materially from such statements, including, among others, risks relating to developments in the PLM industry, competition, failure to innovate and intellectual property. UGS has included a discussion of these and other pertinent risk factors in its registration statement on Form S-4 most recently filed with the SEC. UGS disclaims any intention or obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.
Dora
Smith
+1 314 264 8480
dora.smith@siemens.com